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SI Module Product List

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Introduction of Group Companies: Estakaya Electronic Industries Co., Ltd.

Introduction of Group Companies: Estakaya Electronic Industries Co., Ltd.

We will utilize our independently developed technology and know-how to contribute to the future of society.

Estakaya Electronic Industries Co., Ltd. (formerly known as Sharp Takaya Electronic Industries Co., Ltd., which changed its name on October 1, 2021) has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we also manufacture and sell unique development products utilizing the technology and know-how we have cultivated over many years, as well as sell and provide services for environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.

  • Other electronic parts
  • SI Module

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11ac & BT compatible SiP module 'SX-SDPAC'

11ac & BT compatible SiP module 'SX-SDPAC'

Supports 11ac and Bluetooth(R) v5.0 BR/EDR/LE, low power consumption compact size SDIO SiP module.

The built-in RF front end reduces the development burden of RF peripheral circuits and allows control of both the 5GHz and 2.4GHz bands with a single external antenna. Additionally, its compact size of 6.9mm x 6.9mm contributes to the miniaturization of customer PCBs. 【Features】 ● Dual-band Wi-Fi & Bluetooth(R) v5.0 compatible ● Low power consumption 1x1 SiP module ● Utilizes Qualcomm's QCA9377-3 SoC ● Maximum PHY data rate of 433Mbps (when using 11ac VHT80) ● Equipped with a wireless LAN host interface compatible with SDIO3.0 ● Supports UART as a Bluetooth(R) host interface ● Main power supply: 3.3V, IO power supply: 1.8V or 3.3V ● Compliant with RoHS Directive (2011/65/EU) ● Compact size 6.9 x 6.9 x 1.1 mm ● 80-pin LGA package

  • Wireless LAN
  • SI Module

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[For Base Stations] SiCSBD Module

[For Base Stations] SiCSBD Module

For high frequency and high current applications! SiCSBD module contributing to miniaturization.

In wireless communication base stations, efficient power supply in limited space is required. Especially as base stations become smaller, miniaturization of power units is an important challenge. The SiCSBD module contributes to miniaturization and improved safety. 【Usage Scenarios】 - Power units for wireless communication base stations - Inverters - High-frequency pulse power supplies 【Benefits of Implementation】 - Overvoltage protection - Improved reliability

  • diode
  • SI Module

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